The Advanced Manufacturing Enterprise (AME) subpanel is requesting abstracts for presentations to be given at DMC 2021. The abstract should not exceed 200 words and should explicitly identify the specific thrust area, best practice, or lesson learned that will be presented. Presentations should be no longer than 30 minutes including 5 minutes for speaker introduction and questions. Presentations on the following topics will be given preference:

• Advanced Manufacturing in the world of Industry 4.0
• Model-Based Enterprise from the perspective of the Small and Medium Manufacturers
• Looking forward with the Manufacturing Institutes
• Digitalization of the Advanced Manufacturing to meet Enterprise Business Rules

The Advanced Manufacturing Enterprise Subpanel encompasses the technologies, processes, and practices that foster rapid, superior execution of manufacturing enterprises across the life cycle. The AME Subpanel thrust areas are :

• "Connect the Enterprise" - Enable seamless interoperability of data and processes across organizational boundaries. Topics of interest are the Model Based Enterprise, Data & Taxonomy Standards, Data Integration, Interoperability & Sharing, IT Framework, and Advanced Analytics.
• "Build the Digital Thread" - Drive a continuous flow of integrated design, analysis, and manufacturing information throughout the product/system life cycle. Topics of interest are MBx, Supply Chain & Logistics, Operations & Maintainability, Model Reuse, and Design-Manufacturing Iteration.
• "Create an Agile Factory Floor" - Develop adaptive manufacturing capabilities that integrate factory floor resources for rapid response to the warfighter. Topics of interest are the Intelligent Factory, Artificial intelligence/Machine Learning, Prognosis Health Monitoring (PHM), Agile Adaptive Manufacturing, Production Planning & Scheduling, and Model Based Manufacturing.
• "Ensure a Robust Infrastructure" - Support initiatives and policies to ensure manufacturing infrastructure health and U.S. manufacturing superiority. Topics of interest are Cybersecurity, Workforce Training & Education, and Risk Analysis, Business Processes.

“Biomanufacturing , Biofabrication, and Biotechnology for the Defense Industrial Base” Biotechnology has been identified as a modernization priority in the National Defense Strategy. “Our job is to shape the future force in such a forbidding manner that no adversary ever believes that today is the day they can confront America and win.” – Michael D. Griffin, Under Secretary of Defense for Research and Engineering. We want to enhance future military capabilities, building a more lethal force with greater performance and affordability. Biotechnology applications have already leveraged biology’s disruptive capabilities for agile basing, warfighter performance enhancements, cold chain mitigation for therapeutics/diagnostics, and the biological production of >1000 DoD-relevant molecules, etc. We aim to accelerate technological advancements by building biotechnology capabilities to support a wide range of DoD needs. Developing the U.S. biotechnology industrial base is necessary to demonstrate and hasten the transition of biotechnological solutions to defense applications in areas such as agile basing, sustainment, supply chain assurance/diversification, and warfighter readiness and performance. We are soliciting submissions that articulate the use of biology with direct impact on materials, processes, tools, or technologies in materials, manufacturing, and sustainment for defense applications, in three major areas:

• Creating Materials: Biomanufacturing (specialty chemicals, materials); Biofabrication (living materials, tissue scaffolds, organ-on-chip); Biomaterials; Biocementation
• Sustaining Materials: Decontamination of Aircraft/Infrastructure, Mitigation of Biocorrosion
• Decommissioning Materials: Bioremediation and designed lifetime materials (Using biology to recycle materials as well as using biology to program functionality and lifetime into materials); Biomining/Bioleaching/Bioseparation (harvesting and recycling of critical minerals and chemicals)

Presentations MUST be framed for the DMC audience and have a significant focus on educating that audience in biological concepts/benefits and how they compare to traditional manufacturing processes and synthetic chemistry. Presentations that include brief, high-impact demonstration(s) of biological concepts are highly encouraged. Abstracts that share the relevant details of biotechnology advancements, demonstrations, transitions, and transition risk reduction to products which increase the manufacturing readiness levels of enabling technologies addressing warfighter needs throughout the product life cycle will be given priority.

COMPOSITES PROCESSING AND FABRICATION

The composites processing and manufacturing technology session presentations are sourced from a mix of invited presenters and selected abstracts. You are invited to submit abstracts which describe practical demonstrations of Composites & Plastics Manufacturing and Supporting Technologies which can enable a step change for: system structures at all temperatures (organic matrix, carbon-carbon and ceramic matrix, thermoplastic, and polymeric additive). Areas of interest include: rapid response - agility in composites design/manufacturing in a low volume high mix environment, low cost & attritable structures, automation & robotics, integrated structures, joining, industry 4.0, application of artificial intelligence / machine learning in composites manufacturing, repair technologies and, manufacturing resiliency.

Abstracts should be submitted for presentations which will share the technical details of manufacturing advancements, demonstrations, transition and transition risk reduction to systems requirements which increase the manufacturing readiness levels of enabling technologies addressing warfighter needs.

Only submitted abstracts in which the intent is to share sufficient technical information to provide a springboard to process improvements for the attendees will be considered. Sales pitches are not invited.

The Department of Defense has announced an aggressive schedule for fielding Directed Energy systems, specifically High Energy Lasers (HEL) with combat capabilities. The US Industrial Base and government Manufacturing Technology activities are working closely to insure the timely and cost-effective provision of military grade materials, technologies, and components for system integration and delivery as first units equipped (FUE). We are soliciting presentations from industry and government relevant to the current state of the HEL industrial base, key technologies and components, anticipated and current challenges, and lessons learned for presentation at the Defense Manufacturing Conference.

ELECTRONICS PROCESSING AND FABRICATION

Chairperson: Jim Zunino
Materials Engineer
U.S. Army Combat Capabilities Development Command Armaments Center
Bldg 60
Picatinny Arsenal, NJ
Phone: (973) 724-6773
Email : james.l.zunino.civ@mail.mil

The Electronics Processing and Fabrication Subpanel requests abstracts on key electronics issues and solutions directly related to current defense-related manufacturing activities. In addition current ongoing Manufacturing Technology programs funded by DoD or its departments are encouraged to submit abstracts that show the accomplishments and the Warfighter impacts of their programs. The combined effect of military budget constraints, rapid changes in electronics technology, and the need to deliver superior and affordable weapons to our Warfighters continues to challenge the defense manufacturing community. Compounding the technology challenge is the requirement to sustain many of our existing weapon systems well beyond their original lifetimes. Papers are sought that address the challenges and offer innovative manufacturing technology solutions that will keep our Warfighters second-to-none on any battlefield.

Suggested topics of selected interest include but are not limited to:

• Electro-Optics Technologies
• EO Sensor and Night Vision Systems (including IRFPA)
• Optical Communications and Networking
• Analog Photonic Applications (e.g. beam forming, true time delay, antenna links)
• Laser Systems and Optics (domes, windows, lens, coatings, etc.)
• RF System and Vacuum Tube Component Technologies
• Innovative RF Module Manufacturing Processes, Packaging and Materials
• High Power Amplifier Manufacturing & Thermal Management
• RF Circuit Integration
• Non-Hermetic RF Module Manufacturing & Reliability
• RF System and Component Technologies
• RF System SWAP, Functionality, and Sustainability Enhancement
• Vacuum Electron Devices
• Electronics Packaging & Assembly
• High Reliability Packaging and/or Automated Precision Packaging
• System On a Chip (SOC)
• Embedded Actives and Passives
• High Density Substrates and/or MEMS Packaging
• Advanced Thermal Management
• Affordable Anti-Tamper Microelectronics
• Printed Electronics and Other Innovative & Disruptive Electronics Manufacturing Technologies
• Multi-Material Additive Manufacturing Technology
• Additive Electronics Manufacturing
• Nano Electro Mechanical Systems (NEMS)
• Innovative Nano-Processing for Microelectronics
• Advanced CNT Processing for Microelectronics Devices and Thermal Management
• Graphene Carbon Technologies
• Integrated Photonics Technologies
• High Speed Optical transmissions
• Photonic Integrated Circuits (PICs)
• Photonic Interconnects for Hi-Performance Info Processing Systems
• Optical Waveguides and Nonlinear Optical Integration
• Free-space optical communications
• Photonic Imager and Display Systems
• Flexible Hybrid Electronics
• Hybrid electronics is the convergence of printed electronic and traditional Electronics Packaging & Assembly.
• Topic areas in addition to other sessions: 3D hybrid electronics, integration of electronics and 3D structures
• Harsh environment electronics leveraging hybrid electronics
• Integration of electronics into structural elements
• Manufacturing processes that demonstrate hybrid electronics
• Other Manufacturing USA Institute Topics
• Integration of electronics into fibers and textile structures (For example, Advanced Functional Fabrics of America (AFFOA))
• Electronic sensors and manufacturing process controls for bio-fabrication (For example, Advanced Regenerative Manufacturing Institute (ARMI) / BioFabUSA)
• Electronic sensors and manufacturing process controls for bio-fabrication (For example, Bioindustrial manufacturing innovation institute)
• Power and Energy Sources
• Production base for energy storage and generating devices and components/materials
• Advanced manufacturing initiatives for batteries and fuel cells
• Designing weapon systems for the use of batteries and fuel cells
• Disruptive energy technologies
• Making Advanced energy storage and generation devices cost effective

Selection criteria will include relevance to manufacturing and meeting Warfighter needs. Other topics of interest will also be considered to include any electronics-related topics from the Manufacturing USA Institutes. Selected papers may be used to introduce and support interactive panel discussions or be recommended for poster presentations.

The Co-Chairs of the 2021 DMC Energetics and Munitions Technical Track seek abstracts on energetics and munitions manufacturing technology for consideration in planning for and conducting technical sessions. Presentations should focus on the support of present and future weapon system, subsystem and component performance requirements of the warfighter and discussions on the issues and solutions impacting affordable manufacturing of superior systems and platforms. Areas to consider are affordable process technologies, controls, and analyses; new or improved manufacturing techniques/methods; environmental impacts and resolutions; technology applications and implementation; energetics and munitions life cycle issues such as demilitarization, sustainment, and repair; fuze and additive manufacturing for energetics; and the results from DOD Manufacturing Technology sponsored energetics/munitions activities. The agenda is open to industry, academia, and other government agencies, and/or teaming arrangements that include the areas of interest mentioned above, as well as other topics focusing on energetics and munitions.

The JDMTP-sponsored Manufacturing Readiness Level Working Group is soliciting abstracts for its sessions during this year’s Defense Manufacturing Conference. The Working Group plans to fill out the session slots with a mix of invited presenters and selected abstracts. You are invited to submit abstracts covering a variety of Manufacturing Readiness Level topics, from lessons learned/challenges encountered when applying/implementing MRLs within your program or company to ways you have adapted/applied the MRL tools or discipline to maximize the value and benefits of manufacturing readiness. We especially welcome abstracts capturing the cost and productivity benefits identified through MRL use. Of particular interest this year is the successful use of MRLs in a Science & Technology environment (MRL 3-7) that led to successful technology transfer to an advanced development or production program.

Only submit abstracts in which the intent is to share sufficient technical information to provide a complete story on the value or challenges of MRLs. We are not seeking company marketing pitches, but rather real world MRL application experiences.

Presentations within the Metals track will highlight projects that reduce cost and cycle time, improve manufacturing capability, and/or increase performance or producibility of metals, with special emphasis to projects funded through the DoD ManTech program. Topics of interest to the Metals Processing and Fabrication Subpanel include:

1. Advanced Manufacturing Processes:
a. a. Advanced joining technologies to include new processes, process improvements, new alloys, and dissimilar metal/material joining
b. Advanced forming/machining technologies
c. Additive manufacturing of metals
d. Process models on material effects to guide the factory floor fabrication process
e. Manufacturing technologies suitable for expeditionary deployment
2. Qualification and Certification:
a. Integrated Computational Materials Engineering (ICME)
b. Effects of defects
c. Rapid qualification approaches for metals processing methods and end-use parts
3. Design/Sustainment:
a. Design for manufacturability of metal components
b. Life extension of legacy parts (i.e. manufacturing technology for repair, reset, and or upgrades)
c. Repair of high value components to improve operational availability at reduced cost
d. DOD curation of repair process information
4. Tailorable Materials
a. Performance-based component design
b. Development of modeling and simulation packages that can accurately integrate multiple-material components from chemistry through processing to final properties
c. Communication of local material requirements

• Embedding technical data packages in components
• Digital twins
5. Comprehensive Inspection Strategy for Future Manufacturing Technologies
a. In-process NDE monitoring to inform and reduce post-production inspection requirements
b. In-situ processing adaptations based on in-process inspection/monitoring
c. Incorporation of COTS sensors into manufacturing processes using data gathering to inform better manufacturing processes
d. Development of quantitative inspection criteria

As part of the DMC Conference poster presentations are displayed for audience viewing. Confirmed poster registrants will be displaying their posters in the exhibit hall during the open hours of the Exhibits. We invite you to submit a poster presentation on your real-time work related to Defense Manufacturing and share your views and aspects. This year’s conference theme is: “Building A Strong, Resilient Defense Industrial Base”. The audience is made up of leaders in manufacturing, from government, industry, and academia, exchanging information and perspectives on defense manufacturing policies, strategic direction, best practices, funding opportunities, and the latest manufacturing innovations that will benefit our warfighters.

Poster Session Requirements:

• All Poster Presentations must be cleared for Public Release.
• All Authors are to follow the registration regulations and pay the applicable registration fee to be able to present.
• Supplies will be available for posting your poster presentation; however, it is the presenter’s responsibility to bring their own poster presentation.
• More information will be disseminated to the registered author upon acceptance.