Call for Abstracts

Submissions are now closed.

Technical sessions will be offered throughout the week on topics of relevance to the DoD and national security. Topics will address multi-disciplinary approaches to advancing existing and emerging technology areas to serve the imperative national security interests of the United States. Abstracts will be accepted and reviewed through the following focus areas but should address what and how technology and platforms would benefit from their investment:

The event will encourage engagement from technical experts from multiple disciplines to participate and address comprehensive solutions to some of DoD’s more complex and pressing challenges.

The audience of the conference is made up of government, industry, and academia, ranging from CEO-and Flag Officer/SES-level to working-level manufacturing-oriented engineers, scientists, business practice/policy makers and technology implementers, system designers, and representatives of the warfighters.

Critical Deadlines

Abstract Submission
(No extensions will be given after this date)
Aug 15
Final Presentation Submitted Nov 18


Abstract Topics

Presentations within the Metals track will highlight projects that reduce cost and cycle time, improve manufacturing capability, and increase performance or producibility of metals, with special emphasis to projects funded through the DoD ManTech, RIF and IBIF programs. Topics of interest to the Metals Processing and Fabrication Subpanel include:

  1. Advanced Manufacturing Processes:
  2. a. Advanced joining technologies to include new processes, process improvements, new alloys, and dissimilar metal/material joining
    b. Advanced forming/machining technologies
    c. Additive manufacturing of metals
    d. Process models on material effects to guide the factory floor fabrication process
    e. Technologies to mitigate the long lead times for DOD castings and forgings
  3. Qualification and Certification:
  4. a. Integrated Computational Materials Engineering (ICME)
    b. Nondestructive inspection techniques for novel processes
    c. Effects of defects
    d. Rapid qualification approaches for metals processing methods and end-use parts
  5. Design/Sustainment:
  6. a. Design for manufacturability of metal components
    b. Lightweighting of system designs
    c. Life extension of legacy parts (i.e. manufacturing technology for repair, reset, and or upgrades)
    d. Repair of high value components to extend life at reduced cost
    e. DOD curation of repair process information
  7. Tailorable Materials
  8. a. Performance-based Non-Destructive Evaluation/Inspection standards
    b. Non-Destructive Evaluation/Inspection detection methods
    c. Development of modeling and simulation packages that can accurately integrate multiple-material components from chemistry through processing to final properties
    d. Communication of local material requirements
          i. Embedding technical data packages in components
          ii. Digital twins
    e. Material substitutions
  9. Manufacturing at the Point of Need
  10. a. Manufacturing technologies suitable for expeditionary deployment.
  11. Comprehensive Inspection Strategy for Future Manufacturing Technologies
  12. a. In-process NDE monitoring to inform and reduce post-production inspection requirements
    b. In-situ processing adaptations based on in-process inspection/monitoring
    c. Incorporation of COTS sensors into manufacturing processes Using data gathering to inform better manufacturing processes
  13. Supply Chain
  14. a. Technologies and approaches to improve the metal components supply chain in terms availability, alternative suppliers, or reduced cycle time or cost.

The Electronics Processing and Fabrication Subpanel requests abstracts on key electronics issues and solutions directly related to current defense-related manufacturing activities. In addition, current ongoing Manufacturing Technology programs funded by DoD or its departments are encouraged to submit abstracts that show the accomplishments and the Warfighter impacts of their programs. The combined effect of military budget constraints, rapid changes in electronics technology, and the need to deliver superior and affordable weapons to our Warfighters continues to challenge the defense manufacturing community. Compounding the technology challenge is the requirement to sustain many of our existing weapon systems well beyond their original lifetimes. Papers are sought that address the challenges and offer innovative manufacturing technology solutions that will keep our Warfighters second-to-none on any battlefield.

Suggested topics of selected interest include but are not limited to:

  • Electro-Optics Technologies
    • EO Sensor and Night Vision Systems (including IRFPA)
    • Optical Communications and Networking
    • Analog Photonic Applications (e.g. beam forming, true time delay, antenna links)
    • Laser Systems and Optics (domes, windows, lens, coatings, etc.)
  • RF System and Vacuum Tube Component Technologies
    • Innovative RF Module Manufacturing Processes, Packaging and Materials
    • High Power Amplifier Manufacturing & Thermal Management
    • RF Circuit Integration
    • Non-Hermetic RF Module Manufacturing & Reliability
    • RF System and Component Technologies
    • RF System SWAP, Functionality, and Sustainability Enhancement
    • Vacuum Electron Devices
  • Innovative RF Module Manufacturing Processes, Packaging and Materials
    • High Power Amplifier Manufacturing & Thermal Management
    • RF Circuit Integration
    • Non-Hermetic RF Module Manufacturing & Reliability
    • RF System and Component Technologies
    • RF System SWAP, Functionality, and Sustainability Enhancement
    • Vacuum Electron Devices
  • Electronics Packaging & Assembly
    • High Reliability Packaging and/or Automated Precision Packaging
    • System On a Chip (SOC)
    • Embedded Actives and Passives
    • High Density Substrates and/or MEMS Packaging
    • Advanced Thermal Management
    • Affordable Anti-Tamper Microelectronics
  • Printed Electronics and Other Innovative & Disruptive Electronics Manufacturing Technologies
    • Multi-Material Additive Manufacturing Technology
    • Additive Electronics Manufacturing
    • Nano Electro Mechanical Systems (NEMS)
    • Innovative Nano-Processing for Microelectronics
    • Advanced CNT Processing for Microelectronics Devices and Thermal Management
    • Graphene Carbon Technologies
  • Integrated Photonics Technologies
    • High Speed Optical transmissions
    • Photonic Integrated Circuits (PICs)
    • Photonic Interconnects for Hi-Performance Info Processing Systems
    • Optical Waveguides and Nonlinear Optical Integration
    • Free-space optical communications
    • Photonic Imager and Display Systems
  • Flexible Hybrid Electronics
    • Hybrid electronics is the convergence of printed electronic and traditional Electronics Packaging & Assembly.
    • Topic areas in addition to other sessions: 3D hybrid electronics, integration of electronics and 3D structures
    • Harsh environment electronics leveraging hybrid electronics
    • Integration of electronics into structural elements
    • Manufacturing processes that demonstrate hybrid electronics
  • Other Manufacturing USA Institute Topics
    • Integration of electronics into fibers and textile structures (For example, Advanced Functional Fabrics of America (AFFOA))
    • Electronic sensors and manufacturing process controls for bio-fabrication (For example, Advanced Regenerative Manufacturing Institute (ARMI) / BioFabUSA)
    • Electronic sensors and manufacturing process controls for bio-fabrication (For example, Bioindustrial manufacturing innovation institute)
  • Power and Energy Sources
    • Production base for energy storage and generating devices and components/materials
    • Advanced manufacturing initiatives for batteries and fuel cells
    • Designing weapon systems for the use of batteries and fuel cells
    • Disruptive energy technologies
    • Making Advanced energy storage and generation devices cost effective

Selection criteria will include relevance to manufacturing and meeting Warfighter needs. Other topics of interest will also be considered to include any electronics-related topics from the Manufacturing USA Institutes. Selected papers may be used to introduce and support interactive panel discussions or be recommended for poster presentations.

The Co-Chairs of the 2022 DMC Energetics and Munitions Technical Track seek abstracts on energetics and munitions manufacturing technology for consideration in planning for and conducting technical sessions. Presentations should focus on the support of present and future weapon system, subsystem and component performance requirements of the warfighter and discussions on the issues and solutions impacting affordable manufacturing of superior systems and platforms. Areas to consider are affordable process technologies, controls, and analyses; new or improved manufacturing techniques/methods; environmental impacts and resolutions; technology applications and implementation; energetics and munitions life cycle issues such as demilitarization, sustainment, and repair; fuze and additive manufacturing for energetics; and the results from DOD Manufacturing Technology sponsored energetics/munitions activities. The agenda is open to industry, academia, and other government agencies, and/or teaming arrangements that include the areas of interest mentioned above, as well as other topics focusing on energetics and munitions.

The Department of Defense has announced an aggressive schedule for fielding Directed Energy systems, specifically High Energy Lasers (HEL) with combat capabilities. The US Industrial Base and government Manufacturing Technology activities are working closely to insure the timely and cost-effective provision of military grade materials, technologies, and components for system integration and delivery as first units equipped (FUE). We are soliciting presentations from industry and government relevant to the current state of the HEL industrial base, key technologies, and components, anticipated and current challenges, and lessons learned for presentation at the Defense Manufacturing Conference.


The composites processing and manufacturing technology session presentations are sourced from a mix of invited presenters and selected abstracts. You are invited to submit abstracts which describe practical demonstrations of Composites & Plastics Manufacturing and Supporting Technologies which can enable a step change for: system structures at all temperatures (organic matrix, carbon-carbon and ceramic matrix, thermoplastic, and polymeric additive). Areas of interest include: rapid response - agility in composites design/manufacturing in a low volume high mix environment, low cost & attritable structures, automation & robotics, integrated structures, joining, industry 4.0, application of artificial intelligence / machine learning in composites manufacturing, repair technologies and, manufacturing resiliency.

Abstracts should be submitted for presentations which will share the technical details of manufacturing advancements, demonstrations, transition and transition risk reduction to systems requirements which increase the manufacturing readiness levels of enabling technologies addressing warfighter needs.

Only submitted abstracts in which the intent is to share sufficient technical information to provide a springboard to process improvements for the attendees will be considered. Sales pitches are not invited.

The Advanced Manufacturing Enterprise (AME) subpanel is requesting abstracts for presentations to be given at DMC 2022. The abstract should not exceed 200 words and should explicitly identify the specific thrust area, best practice, or lesson learned that will be presented. Presentations should be no longer than 30 minutes including 5 minutes for speaker introduction and questions. Presentations on the following topics will be given preference:

  • Advanced Manufacturing in the world of Industry 4.0
  • Model-Based Enterprise from the perspective of the Small and Medium Manufacturers
  • Looking forward with the Manufacturing Institutes
  • Digitalization of the Advanced Manufacturing to meet Enterprise Business Rules
The Advanced Manufacturing Enterprise Subpanel encompasses the technologies, processes, and practices that foster rapid, superior execution of manufacturing enterprises across the life cycle. The AME Subpanel thrust areas are:
  • "Connect the Enterprise" - Enable seamless interoperability of data and processes across organizational boundaries. Topics of interest are the Model Based Enterprise, Data & Taxonomy Standards, Data Integration, Interoperability & Sharing, IT Framework, and Advanced Analytics.
  • "Build the Digital Thread" - Drive a continuous flow of integrated design, analysis, and manufacturing information throughout the product/system life cycle. Topics of interest are MBx, Supply Chain & Logistics, Operations & Maintainability, Model Reuse, and Design-Manufacturing Iteration.
  • "Create an Agile Factory Floor" - Develop adaptive manufacturing capabilities that integrate factory floor resources for rapid response to the warfighter. Topics of interest are the Intelligent Factory, Artificial intelligence/Machine Learning, Prognosis Health Monitoring (PHM), Agile Adaptive Manufacturing, Production Planning & Scheduling, and Model Based Manufacturing.
  • "Ensure a Robust Infrastructure" - Support initiatives and policies to ensure manufacturing infrastructure health and U.S. manufacturing superiority. Topics of interest are Cybersecurity, Workforce Training & Education, and Risk Analysis, Business Processes.

Biotechnology has been identified as a critical technology area by the Office of the Secretary of Defense. The Under Security of Defense for Research and Engineering includes biotechnology as a critical technology area:

Biotechnology is an emerging engineering discipline that uses living systems to produce a wide range of technologies and capabilities. From fighting global pandemics and avoiding surprises to reducing logistics and sustainment costs and increasing energy efficiency, biotechnology can help change the way the Department conducts missions, performs in contested logistics environments, and adapts to major global changes.

Biotechnology applications have already leveraged biology’s disruptive capabilities for agile basing, warfighter performance enhancements, cold chain mitigation for therapeutics/diagnostics, etc. We aim to accelerate technological advancements by building biotechnology capabilities to support a wide range of DoD needs. Developing the U.S. biotechnology industrial base is necessary to demonstrate and hasten the transition of biotechnological solutions to defense applications in areas such as agile basing, sustainment, supply chain assurance/diversification, and warfighter readiness and performance. We are soliciting submissions that articulate the use of biology with direct impact on materials, processes, tools, or technologies in materials, manufacturing, and sustainment for defense applications, in four major areas:

  • Creating Materials: Biomanufacturing (specialty chemicals, materials); Biofabrication (living materials, tissue scaffolds, organ-on-chip); Biomaterials; Biocementation
  • Sustaining Materials: Decontamination of Aircraft/Infrastructure, Mitigation of Biocorrosion
  • Decommissioning Materials: Bioremediation and designed lifetime materials (Using biology to recycle materials as well as using biology to program functionality and lifetime into materials); Biomining/Bioleaching/Bioseparation (harvesting and recycling of critical minerals and chemicals)
  • Therapeutics: Biological therapeutics to enhance Warfighter return to duty, including the manufacturing processes necessary to produce these products in a commercially sustainable way. This can also include healthcare delivery platforms to mitigate supply chain challenges and other logistics limitations.

Presentations MUST be framed for the DMC audience and have a significant focus on educating that audience in biological concepts/benefits and how they compare to traditional manufacturing processes and synthetic chemistry. Presentations that include brief, high-impact demonstration(s) of biological concepts are highly encouraged. Abstracts that share the relevant details of biotechnology advancements, demonstrations, transitions, and transition risk reduction to products which increase the manufacturing readiness levels of enabling technologies addressing warfighter needs throughout the product life cycle will be given priority.

The JDMTP-sponsored Manufacturing Readiness Level Working Group is soliciting abstracts for its sessions during this year’s Defense Manufacturing Conference. The Working Group plans to fill out the session slots with a mix of invited presenters and selected abstracts. You are invited to submit abstracts covering a variety of Manufacturing Readiness Level topics, from lessons learned/challenges encountered when applying/implementing MRLs within your program or company to ways you have adapted/applied the MRL tools or discipline to maximize the value and benefits of manufacturing readiness. We especially welcome abstracts capturing the cost and productivity benefits identified through MRL use.

Only submit abstracts in which the intent is to share sufficient technical information to provide a complete story on the value or challenges of MRLs. We are not seeking company marketing pitches, but rather real world MRL application experiences.

General Rules

  • Please ensure that your management has approved your participation (to include travel and registration costs) in the conference before submitting an abstract. Online registration will open late September 2022. Registration fees will be $945 for full registration.)
  • Abstracts should include a concise description of the content, conclusions, and significance of the proposed presentation. Abstracts must be approved for public release. If the author has presented similar information at previous conferences, then the abstract should clearly state what new results or information will be presented.
    • Please limit the abstract to approximately 200-500 words and do not include the abstract title, authors, or any other information other than the abstract in the area labeled "Abstract" on the online submission form.


Submission Rules

All submissions must comply with the following guidelines. Failure to observe these requirements may result in a rejection of the abstract.

  1. Abstracts are solicited on topics that are considered Controlled Unclassified Information (CUI) and may be controlled by U.S. International Traffic in Arms Regulations (ITAR) and cannot be presented in completely open forums. All abstracts must be unrestricted and cleared for public release.
  2. Click on the topics listed to thoroughly review the requirements of each session and determine the best topic that fits your abstract (submissions uploaded to wrong session/topic could cause for rejection). Conference committee may determine that your abstract fits better in another session and moves abstract.
  3. Abstracts should be between 200 - 500 words
  4. Abstracts should include a concise description of the content, conclusions, and significance of the proposed presentation.
  5. The abstract field will only accept text. Do not provide abstract title, authors, or any other information other than the abstract in this “abstract” field.
  6. Abstract Title, Author, etc. are to be provided on the abstract submittal form, not in the “abstract” field.
  7. Submit abstracts through the online process (no other means of submittal).
  8. Presenting authors must be approved by their management to attend and understand that the registration fee is required. Due to the large number of technical speakers associated with the Conference, waiving fees or offering discounted fees are not viable option for the conference.
  9. Confirmation email will be sent out after the abstract is successfully submitted and processed. If you have questions or problems with your submission, contact or the conference help desk at 937-739-8120.


Helpful Tips for Writing Abstracts

Be Clear…Be Clean…

When writing your abstract make sure you address key elements of your presentation.

  1. Quality of Abstract – Shows indicative quality of the final presentation at the conference.
  2. Be concise – Stay within the allotted word count. Reviewers are reading many abstracts and long abstracts are not looked at fondly. Address specific items.
    • Succinct Statement of WHAT is the problem (1-2 sentences preferred)
    • HOW is the approach NOVEL to solving the problem
    • WHY the work is important to the Warfighter (enables greater range, lower cost, new capability?)
  3. Originality of Work – Is it a Hot Topic? Represent new information?
  4. State the thesis, synopsize the presentation, tease the conclusion
  5. Usefulness of Work – Benefits and widespread applications/ anything new that otherwise would be ignored
  6. Failures can be as edifying as success stories
  7. Presentation – No sales pitch
  8. Avoid extraneous jargon, over-the-top phrasing and writing too broad about the Topic
  9. Keep it Simple


Selection of Abstracts

In general, the abstract committee evaluates the abstracts on the following basis:

  • Clarity of Presentation: Does the abstract clearly define the topic, scope, and methodologies?
  • Argument: Does the abstract clearly lay out the technical argument?
  • Theme: Does the abstract follow the session focus?


Presentation Selection

If your abstract is selected for presentation at DMC 2022, you will be requested to submit presentation materials to ARCTOS in electronic format no later than November 18, 2022. Upon acceptance of your abstract, specific instructions for technical preparation will be provided. PLEASE NOTE: Only one author can be identified as the presenter and make the presentation.


Requirements if Your Presentation is Selected

  • 50–100-word biography
  • Presentation received by Due Date
  • Presentation for loading onto session computers
  • Each presenter must not exceed 30 minutes (including Q&A time).
  • Presentations that are accepted must participate at the time scheduled by the Symposium Committee.
  • If your abstract is selected and you accept, you will be considered a conference attendee and will be required to pay the full attendee registration. There are too many speakers associated with this conference to waive fees or to offer discounted fees and still be a viable conference. Please make note of this when submitting your abstract.


Each Technical Session Room will be equipped with the following audio-visual devices:

  • LCD Projector
  • Computer with PowerPoint installed
  • Projection Screen
  • Microphone