Abstracts

All DMC Technical sessions will be held at the Tampa Convention Center.

Abstracts are solicited on topics that are controlled by U.S. International Traffic in Arms Regulations (ITAR) and cannot be presented in completely open forums.
All abstracts must be unrestricted and cleared for public release, though the final presentations given at the conference will be ITAR resticted.

Abstract Submission is Closed

Abstracts (200-500 word summary) submittals will be accepted for the following topics. Topic Areas for consideration are: (ABSTRACTS MUST BE UNCLASSIFIED, PUBLIC RELEASABLE, AND NON-PROPRIETARY)

The ManTech Advanced Manufacturing Enterprise subpanel is requesting abstracts for presentations to be given at DMC 2017. Abstracts that emphasize warfighter or defense industrial base relevance and impact will be given preference. Presentations should be no longer than 30 minutes including time for speaker introduction and questions. Abstracts should focus on the JDMTP AME Subpanel thrust areas:

  • "Connect the Enterprise" - Enable seamless interoperability of data and processes across organizational boundaries (Model Based Enterprise, Data & Taxonomy Stds, Data Integration, Interoperability & Sharing, IT Framework, Advanced Analytics);
  • "Build the Digital Thread" - Drive a continuous flow of integrated design, analysis, and manufacturing information throughout the product/system life cycle (MBx, Supply Chain & Logistics, Operations & Maintainability, Model Reuse, Design-Manufacturing Iteration);
  • "Create an Agile Factory Floor" - Develop adaptive manufacturing capabilities that integrate factory floor resources for rapid response to the warfighter (Intelligent Factory, Machine Analytics, Adaptive Manufacturing, Rapid Response, Production Planning & Scheduling, Model Based Manufacturing);
  • "Ensure a Robust Infrastructure" - Support initiatives and policies to ensure manufacturing infrastructure health and U.S. mfg superiority (CyberSecurity, Workforce Training & Education, Risk Analysis, Business Processes).

In addition to these four thrust areas, the AME subpanel recently formed a new working group, Digital Information Visualization Working Group (DIVWG). The DIVWG plans to assess and influence maturation of methods to visualize digital information on the factory floor and in workforce training, particularly where DoD requirements are unique. The primary focus will be on augmented reality work instructions (overlaying digital information with the real world via hand-held devices, projection, or wearables), although digital work instructions, haptic feedback, and virtual reality are also of interest. Please limit the length of the abstract to 500 words.

The composites manufacturing technology session presentations are expected to be primarily sourced from invited presenters. However, the subpanel will consider outstanding technical abstracts which validate and apply advanced manufacturing technologies. You are invited to submit abstracts focused on cutting edge manufacturing advancements supporting organic matrix composite, ceramic matrix composite, carbon-carbon, as well as related processes such as polymeric additive manufacturing. Abstracts should be submitted for presentations which will share the technical details of manufacturing advancements, demonstrations, transition and transition risk reduction to products which increase in the manufacturing readiness level of enabling technologies addressing warfighter needs. Only submit abstracts where the intent is to share sufficient technical details which may provide a springboard to process improvements for the audience.

The Electronics Processing and Fabrication Subpanel requests abstracts on key electronics issues and solutions directly related to current defense-related manufacturing activities. In addition current ongoing Manufacturing Technology programs funded by DoD or its departments are encouraged to submit abstracts that show the accomplishments and the Warfighter impacts of their programs. The combined effect of military budget constraints, rapid changes in electronics technology, and the need to deliver superior and affordable weapons to our Warfighters continues to challenge the defense manufacturing community.
Compounding the technology challenge is the requirement to sustain many of our existing weapon systems well beyond their original lifetimes. Papers are sought that address the challenges and offer innovative manufacturing technology solutions that will keep our Warfighters second-to-none on any battlefield.

Suggested topics of selected interest include but are not limited to:
  • Electro-Optics Technologies
    • EO Sensor and Night Vision Systems (including IRFPA)
    • Optical Communications and Networking
    • Analog Photonic Applications (e.g. beam forming, true time delay, antenna links)
    • Laser Systems and Optics (domes, windows, lens, coatings, etc.)
  • Integrated Photonics Technologies
    • High Speed Optical transmissions
    • Photonic Integrated Circuits (PICs)
    • Photonic Interconnects for Hi-Performance Info Processing Systems
    • Optical Waveguides and Nonlinear Optical Integration
    • Free-space optical communications
    • Photonic Imager and Display Systems
  • RF System and Vacuum Tube Component Technologies
    • Innovative RF Module Manufacturing Processes, Packaging and Materials
    • High Power Amplifier Manufacturing & Thermal Management
    • RF Circuit Integration
    • Non-Hermetic RF Module Manufacturing & Reliability
    • RF System and Component Technologies
    • RF System SWAP, Functionality, and Sustainability Enhancement
    • Vacuum Electron Devices
  • Power and Energy Sources
    • Production base for energy storage and generating devices and components/materials
    • Advanced manufacturing initiatives for batteries and fuel cells
    • Designing weapon systems for the use of batteries and fuel cells
    • Disruptive energy technologies
    • Making Advanced energy storage and generation devices cost effective
  • Electronics Packaging & Assembly
    • High Reliability Packaging and/or Automated Precision Packaging
    • System On a Chip (SOC)
    • Embedded Actives and Passives
    • High Density Substrates and/or MEMS Packaging
    • Advanced Thermal Management
    • Affordable Anti-Tamper Microelectronics
  • Directed Energy Technologies
    • Solid State Laser (Thermal Management, High Power Laser Diodes, Adaptive Optics, Beam Control)
    • High Power Microwave (Thermal Management, Low Loss Windows, Switches and Capacitors, Low Temperature + High Power Dielectrics)
  • Printed Electronics and Other Innovative & Disruptive Electronics Manufacturing Technologies
    • Multi-Material Additive Manufacturing Technology
    • Additive Electronics Manufacturing
    • Nano Electro Mechanical Systems (NEMS)
    • Innovative Nano-Processing for Microelectronics
    • Advanced CNT Processing for Microelectronics Devices and Thermal Management
    • Graphene Carbon Technologies

    Selection criteria will include relevance to Warfighter needs. Other topics of interest will also be considered. Selected papers may be used to introduce and support interactive panel discussions or be recommended for poster presentations.

The Co-Chairs of the 2017 DMC Energetics and Munitions Technical Track seek abstracts on energetics and munitions manufacturing technology for consideration in planning for and conducting technical sessions. Presentations should focus on the support of present and future weapon system, subsystem and component performance requirements of the warfighter and discussions on the issues and solutions impacting affordable manufacturing of superior systems and platforms. Areas to consider are affordable process technologies, controls, and analyses; new or improved manufacturing techniques/methods; environmental impacts and resolutions; technology applications and implementation; energetics and munitions life cycle issues such as demilitarization, sustainment, and repair; and the results from DOD Manufacturing Technology sponsored energetics/munitions activities. The agenda is open to industry, academia, and other government agencies, and/or teaming arrangements that include the areas of interest mentioned above, as well as other topics focusing on energetics and munitions.

Presentations within the Metals track will highlight projects that reduce cost and cycle time, improve manufacturing capability, and increase performance or producibility of metals, with special emphasis to projects funded through the DoD ManTech, RIF and IBIF programs. Topics of interest to the Metals Processing and Fabrication Subpanel include:

  1. Advanced Manufacturing Processes:
    a. Advanced joining technologies to include new processes, process improvements, new alloys, and dissimilar metal/material joining
    b. Advanced forming/machining technologies
    c. Additive manufacturing of metals
    d. Process models on material effects to guide the factory floor fabrication process
  2. Qualification and Certification:
    a. Integrated Computational Materials Engineering (ICME)
    b. Nondestructive inspection techniques for novel processes
    c. Effects of defects
    d. Rapid qualification approaches for metals processing methods and end-use parts
  3. Design/Sustainment:
    a. Design for manufacturability of metal components
    b. Lightweighting of system designs
    c. Life extension of legacy parts (i.e. manufacturing technology for repair, reset, and or upgrades)
    d. Reverse engineering of rare and obsolete parts
    e. Repair of high value components to extend life at reduced cost
  4. Tailorable Materials
    a. Performance-based Non-Destructive Evaluation/Inspection standards
    b. Non-Destructive Evaluation/Inspection detection methods
    c. Development of modeling and simulation packages that can accurately integrate multiple-material components from chemistry through processing to final properties
    d. Communication of local material requirements
    • i. Embedding technical data packages in components
    • ii. Digital twins
    e. Material substitutions
  5. Comprehensive Inspection Strategy for Future Manufacturing Technologies
    a. In-process NDE monitoring to inform and reduce post-production inspection requirments
    b. In-situ processing adaptations based on in-process inspection/monitoring
    c. Larger sensor packages
    d. Data security
    e. Incorporation of COTS sensors into manufacturing processes Using data gathering to inform better manufacturing processes

Questions concerning Abstracts should be directed to the

Critical Dates Close/Date
Abstract Submission August 14, 2017
Abstract Notification for Acceptance/Denial August 31, 2017
Presentation Due to UTC November 17, 2017

Presentation Selection

If your abstract is selected for presentation at DMC '17, you will be requested to submit presentation materials to UTC in electronic format no later than November 17, 2017. Upon acceptance of your abstract, specific instructions for technical preparation will be provided. PLEASE NOTE: Only one author can be identified as the presenter and make the presentation.

What is Required if Your Presentation is Selected?

  • 50-100 Word Biography Sketch of Presenter
  • Presentation for inclusion on CD Proceedings
  • Presentation for loading onto session computers
  • Each Presentation must not exceed 30 minutes (including Q&A time)
  • Presentations that are accepted must participate at the time scheduled by the Conference Committee
  • If your abstract is selected and you accept, you will be considered as an attending participant to the conference and will be required to pay the full attendee registration, as long as you are approved to attend the event by your management.
Each Technical Session Room will be equipped with the following audio-visual devices:
  • LCD Projector
  • Computer with PowerPoint installed
  • Projection Screen
  • Microphone

Contact Call for Abstracts Manager


Universal Technology Corporation
1270 North Fairfield Road
Dayton, OH 45432-2600

Telephone: (937) 426-2808
Fax: (937) 426-8755